Product news

Equipment manufacturers can choose from a wide variety of COM standards to satisfy their requirements related to performance, cost, power consumption, size, and I/O, along with other options.

COM-HPC Client Type Module & Server Type Module

The EZX-EHLP, with Intel® Pentium®/Celeron®/Atom™ SoC BGA Processor (Elkhart Lake Platform 4.5~12W), CPU bottom mounted, with huge improvement on performance and bug step ahead with Intel® UHD Graphics target entry-level application market.

Engicam presents MicroGEA MX8ULP based on new NXP® i.MX 8ULP processor that features up to two Arm® Cortex®-A35 running at 1 GHz, an Arm Cortex-M33 core. This module brings ultra-low power processing advanced integrated security and a graphical engine.

Introducing ARBOR’s latest COM Express Compact Type 6 CPU Module - EmETXe-i92U0. It is equipped with Intel’s 11th generation Tiger Lake Processor (Core™ i7-1185G7E/ i5-1145G7E/ i3-1115G4E/ Celeron 6305E.).

The board is designed for embedded long-term availability of at least seven years, which eliminates the design risks

ADLINK’s COM-HPC Ampere Altra Server Type module is based on Ampere ® Altra ® SoC using the Arm ® Neoverse ™ N1 architecture.

I-Pi SMARC Development Kit based on Qualcomm® Robotics RB5 Platform

Vecow and MediaTek are working together to advance Edge AI computing capabilities.

The feature set in detail. The new conga-HPC/cALP COM-HPC Client Size A modules (95x120mm), as well as the conga-TC670 COM Express Compact Type 6 modules (95x95mm) are available with 6 energy efficient 12th Gen Intel Core processors as well as a cost optimized Celeron processor.

Digi ConnectCore MP1 modules deliver a highly integrated and secure connected system-on-module solution.

Powerful dual or quad Cortex-A53 processor with Neural Processing Unit.

The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz.

EmNANO-i230V is powered by Intel’s Atom E3825/E3845 Processor, the compact size COM Express Mini Type 10 form factor offers flexibility and scalability that are critical to system integrations.

The TQMa8MP based on the i.MX 8M Plus supports with many features and an integrated NPU (Neural Processor Unit) with up to 2.3 TOPS and an IPU (Image Processor Unit)

ADLINK’s deep learning accelerators provide GPU-accelerated inferencing in embedded and standard form factors and offer high performance, power efficiency and longevity support required of edge AI applications

General-purpose Carrier Board compliant with Engicam standard SmarCore SOMs and Open Frames.

Alcom brings Arbor's embedded computing products to the Benelux market.