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COM Express 3.1 specification with compliant Computer-on-Modules

09/12/2022

congatec welcomes the ratification of the COM Express 3.1 standard with the launch of 10 compliant Computer-on-Modules based on 12th Gen Intel Core processors (formerly codenamed Alder Lake). The modules will be equipped with the new updated 16 Gbps COM Express connector and support high-speed interfaces such as PCIe 4.0 and USB 3.2. As upgrades of the already existing family of COM Express Type 6 modules, the new 3.1 compliant modules offer up to 14 cores/20 threads. With these new modules, customers can now give their designs a performance boost that is compliant to this officially ratified specification. This delivers maximum design security and safeguards reliable high-performance roadmaps for existing COM Express designs long into the future.

Main Features

  • Intel® hybrid design combines Performance-cores with Efficient–cores
  • Up to Intel® Iris® XeGraphics® architecture with up to 96 EUs
  • PCI Express Gen 4 | USB 3.2
  • AI Acceleration with Intel® Deep Learning Boost (VNNI)
  • Embedded Use Condition SKUs
Documents Tech question
Congatec TC670

COM Express 3.1 specification with compliant Computer-on-Modules

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    Computer & System-on-Modules

Congatec

Congatec is a rapidly growing technology company focussing on high-performance embedded computing products, so-called computer-on-modules and industrial single board computer.

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Documents

  • Congatec conga TC670 Datasheet
Pexels thisisengineering 3913017

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