Product news

Designed to make Proof of Concept (PoC) easier, the ADLINK AI Camera Dev Kit integrates the NVIDIA® Jetson Nano™ SOC, an 8MP color MIPI camera module and validated software drivers to save effort on integration and solve compatibility issues.

Arora-V 22nm High-Performance FPGA family Arora-V high performance FPGA family utilizing advanced 22nm SRAM technology and integrating 270Mbps12.5Gbps high speed SerDes interfaces, PCIe 2.1 hard core with support for PCIe x1, x2, x8 modes, along with MIPI hard core single lane module at up to 2.5Gbps, and DDR3 interfacing at speeds up to 1333 Mbps.

To ensure that your PCIe M.2 SSDs operate at high speeds over sustained periods of time and to prevent overheating in embedded systems, Transcend offers customizable thermal control solutions

ADLINK’s new DLAP-400 and DLAP-200 series Edge AI Platforms based on NVIDIA^® Jetson^™ Orin technology will be set to provide enhanced deep-learning acceleration with a wide variety of industrial I/O ports and visual inferencing capabilities, all packed in a durable, fanless, and energy-efficient design, while supporting extended operating temperatures.

New COM-HPC Client Computer-on-Modules based on high-end processor variants of the 13th Gen Intel Core processors.

Avalue released the semi-rugged NUC-TGU and fast-to-implement ACS10-TGU box PCs. Both PCs are powered by Intel® 11th-Gen Tiger Lake UP3,

The SMARC 2.1 module TQMxE41S is available with a wide variety of processors in the power range 6 W to 15 W TDP.

The compact fanless box PC is playing a vital role in machine vision of manufacturing automation and smart industry.

ADLINK industrial ATX Motherboards deliver optimized system performance and I/O flexibility, with an emphasis on motherboard stability and lifetime.

Pulse has expanded its range of high-power catalogue flyback transformer in the EFD15+ package with the introduction of the PAT6261 series.

Complete Box PCs Feature Intel 11th Gen CPUs and GPUs for AI and Deep Learning at the Edge

HMB SMD High Capacitance Ultra-Low ESR Conductive Polymer Aluminum Solid Electrolytic Capacitors

SealSQ highlights its PKI services and hardware secure elements for some popular applications requiring its technology.

• A vision development kit with the NVIDIA® Jetson Nano module and image sensor, industrial DI/O, issue-free integration and affordable price

Fiboocom is proud to announce that its innovative 5G module FG160/FM160 series have been awarded as the "2022 Mobile Breakthrough Award" under the category of "Embedded Wireless Solution of the Year".

COM Express R3.1 Compliant Modules — ADLINK Express-ADP Type 6 Basic size and Express-ID7 Type 7 Basic size Now Available

Powered by 12th Gen Intel® Core™ processor and integrated with the NVIDIA®/AMD graphics card, the ECX-3000 PEG Series provides powerful, flexible and advanced AI productivity and is available in six modules.

MPS Power Modules offer superior performance and size advantages when compared to other industry leading solution.