Main Features
- Intel® hybrid design combines Performance-cores with Efficient–cores
- Intel® UHD Graphics 730/770 driven by Xe Architecture
- PCI Express Gen 4/5 | USB 3.2 Gen 2x2
- AI Acceleration based on Intel® Deep Learning
- Embedded Use Condition SKUs
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New COM-HPC Client Computer-on-Modules based on high-end processor variants of the 13th Gen Intel Core processors. The launch expands the already available portfolio of high-performance COM-HPC modules with soldered processors to include the even more powerful socketed variants of this processor generation. The new conga-HPC/cRLS Computer-on-Modules in COM-HPC Size C form factor (120x160mm) address application areas that require especially outstanding multi-core and multi-thread performance, large caches, and enormous memory capacities combined with high bandwidth and advanced I/O technology. Target markets are performance-hungry industrial, medical, and edge applications utilizing artificial intelligence (AI) and machine learning (ML), as well as all types of embedded and edge computing solutions with workload consolidation requirements for which congatec also supports real-time hypervisor technologies from Real-Time Systems.
Congatec is a rapidly growing technology company focussing on high-performance embedded computing products, so-called computer-on-modules and industrial single board computer.