Product news

The success of COM Express in the embedded market is a result of the broad respect given to the PICMG consortium.

These new industrial-grade Computer-on-Modules are ideal for high-performance AI edge applications with an ultra-low power (ULP) envelope featuring dual Arm Cortex-A72 processors, powerful AI accelerators, and 3D graphics.

Engicam announced a preview of the release of the new C.TOUCH 3.0 carrier board, a versatile platform with a capacitive touch interface, compliant with the EDIMM 2.0 standard.

The conga-TC570r COM Express Type 6 Compact modules, based on the 11th Generation Intel® Core™ processor family (code name "Tiger Lake"), have received IEC-60068 certification.

The Digi ConnectCore® MP1 system-on-module (SOM) platform offers a comprehensive IoT development solution

Powered by MediaTek Genio 1200(8-core Arm Cortex-A78) processor with a 5-core Arm Mali-G57 GPU for advanced 3D graphics and an integrated APU for on-board AI

The new Engicam COMe module, based on Intel® processors ELKHART LAKE series ATOM x6000E, Pentium and Celeron.

The ECM-ADLS, a 3.5-inch single board computer, features supporting for both Intel® 12^th & 13^th generation processors with LGA 1700 CPU socket, which is the first Avalue 3.5" SBC to incorporate DDR5 design.

The demands on agriculture to produce more, at lower prices, with higher quality and at the same time protect the environment, seem contradictory at first glance.

Laird Connectivity is setting to release the Tungsten700 SMARC System-On-Module (SoM) operating with a MediaTek Genio 700 processor and Laird Connectivity's imminent Sona MT320 Wi-Fi 6/Bluetooth 5.3 module.

Adlink is delighted to introduce the MXM-AXe GPU module, a groundbreaking innovation that revolutionizes embedded graphics processing.

EmETXe-i92U0 is specifically built to withstand harsh environments, with a wide range power input of 8.5-20V and an operating temperature range of -40 to 85°C.

A new Engicam COMe module, based on Intel® TIGER LAKE processors with the new Intel® Iris® Xe graphics.

Digi’s suite of embedded solutions are designed to simplify and accelerate the development, deployment and management of secure, connected devices that can be managed and updated throughout their lifecycle.

Get into the fast lane to IoT-connected industrial application development with our conga-SA7 Computer-on-Modules.

Engicam presents the new MicroGEA STM32MP13 based on the latest ST® processor equipped with Arm® Cortex®-A7 up to 1GHz. T

The latest SMARC modules leverage the TI Jacinto 7™ processor, bringing accelerated vision and AI processing alongside real-time control to your industrial and mobile machinery solutions.

In attachment you can download an article written by Christian Eder, Director of Marketing at Leading CoM module manufacturer Congatec, represented since its foundation by Alcom electronics.