Product news

SMARC Module based on TI Processors TDA4VM and DRA829J

New COM Express Compact modules with AMD Ryzen Embedded 8000 Series for high-performance AI applications at the edge

The OSM-IMX93 is an OSM R1.1 Size-L module featuring NXP® i.MX93 series processor with 2-core Arm Cortex-A55 & M33.

When it comes to selecting what goes into the custom hardware for embedded systems, developers have more choices than ever—and each has its own sweet spot.

New high-performance computer-on-modules (COMs) with i.MX 95 processors from NXP, thereby expanding its extensive module portfolio with low-power NXP i.MX Arm processors.

NXP i.MX 8M Plus 14nm processor series with ARM 4-Core Cortex-A53 / M7 + NPU.

The QMxCU1-HPCM equipped with Intel Core Ultra processors offers impressive performance data in the field of AI and graphics for the edge.

The LEC-IMX95, based on the powerful NXP i.MX95 (6x Arm Cortex-A55 + 1x Arm Cortex-M7 + 1x Arm Cortex-M33) processor with an integrated ISP and eIQ Neutron Neural Processing Unit (NPU) operating at up to 2 TOPS

Discover the future of High Performance and low power with NXP-based ARM-Cortex-A55 processors based modules.

SMARC Adapter SOM and SBC reference designs provide maximum flexibility and scalability for Digi ConnectCore SOMs

TQ uses the MBa8MP-RAS314 to support a smooth transition of your embedded systems through custom designs.

Introducing our latest advancements: the SmarCore STM32MP25x and i.Core STM32MP25x. modules, powered by the cutting-edge STM32 MPUs from ST® Microprocessors.

Looking for an affordable and versatile single-board computer with broad compatibility? It's budget-friendly and accessible to a wide range of users.

ADLINK introduces two new modules, one COM Express and one SMARC, based on the latest Intel® Atom processors

In a versatile standard for small-size and low-cost soldered-down including the OSM-IMX93 (NXP i.MX 93), OSM-IMX8MP (NXP i.MX 8M Plus) a complete and competitive product portfolio based on leading edge CPU cores suited for a variety of applications will be announced and available shortly(Q2’24).

Congatec expanded its ecosystem for modular edge servers. New products include a server carrier board in µATX form factor and COM-HPC Server-on-Modules based on the latest Intel Xeon D processors (Ice Lake).

Explore high-performance embedded building blocks that drive efficiency, performance, and adaptability from COM to cloud, revolutionizing embedded computing designs.

Our innovative 5-Cent Cooling Solution is also compatible with the DHCOM i.MX8M Plus SOM.