Product news

The portfolio now ranges from high-performance COM-HPC Server-on-Modules to ultra-compact and brand-new COM-HPC Client-on-Modules that are hardly larger than a credit card.

New COM-HPC Client Computer-on-Modules based on high-end processor variants of the 13th Gen Intel Core processors.

Availability of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA assembly.

The new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini standard is now entering the home stretch towards final ratification, which is scheduled for the first half of 2023.

congatec welcomes the ratification of the COM Express 3.1 standard with the launch of 10 compliant Computer-on-Modules based on 12th Gen Intel Core processors (formerly codenamed Alder Lake).

The goal of the comprehensive edge computing platform portfolio for TSN is to make it as easy for real-time solution providers to build time sensitive networks for smart factory and critical infrastructure operators as deploying standard Ethernet infrastructures.

The board is designed for embedded long-term availability of at least seven years, which eliminates the design risks

The feature set in detail. The new conga-HPC/cALP COM-HPC Client Size A modules (95x120mm), as well as the conga-TC670 COM Express Compact Type 6 modules (95x95mm) are available with 6 energy efficient 12th Gen Intel Core processors as well as a cost optimized Celeron processor.

Congatec welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs.

2th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules

New 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.

The conga-SMX8-Plus is a SMARC 2.1 module based on NXP i.MX 8M Plus 14nm processor series with ARM 4-Core Cortex-A53 / M7 + NPU.

Integrated AI accelerators and 28 GB DDR4 RAM enable graphics intensive workloads to ‘see’ a boost of up to 70% compared to predecessors.

Fast track to NPU accelerated smart vision

Alcom is happy to announce the newest '21 product guide from Congatec.

The new SMARC 2.1 modules for vision and AI applications feature four quad-core Arm Cortex-A53 based NXP i.MX 8M Plus processors for the industrial (0°C to +60°C) or extended temperature ranges (-40°C to +85°C) as well as in-line ECC for up to 6 GB LPDDR4 memory.

Congatec introduces the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG® COM-HPC™ standard.

The new congatec conga-TCV2 on the COM Express Compact powered by the new Ryzen Embedded V2000 processor impresses with up to 2x generational uplift in performance per watt, a 2x more CPU cores compared to previous generations, at only 76% of the previous size on a 100% pin-compatible form factor.