Product news

The EAC-4000 is a highly compact and powerful Edge AI Computing System. Powered by NVIDIA® Jetson Orin™ NX and Jetson Orin™ Nano system-on-modules

The AIB-NVAO, an embedded AI industrial computer specifically designed for autonomous machine intelligence.

TPC-DCS101E1 series is a low power-consumption, Fan-less designed, enhanced stability and reliability industrial widescreen 10.1-inch industrial Panel PC product.

EmWicon Wi-Fi and Bluetooth module solutions provides AP module and Client module products.

Rapidly deploy, configure, secure and manage devices at any distance

Brand new product line for smart manufacturing, the SiER series! SiER series is our AIoT solution includes Modbus gateway and Ethernet switch, which support comprehensive protocols and smart visualization software.

Semtech announces the integration of Non-Terrestrial Network (NTN) support into its HL series LPWA modules, specifically the HL7810 and HL7812.

The ADLINK automated optical inspection (AOI) solution is built with an Intel CPU, Intel GPUs, and ADLINK AI models that are optimized by OpenVINO toolkit.

The BG21 has the industry's longest range and is the only SoC with +20 dBm TX power, ideal for line powered devices. The BG22 is the most energy-efficient SoC enabling 10+ years lifetime with a coin cell battery. The ultra-low power BG24 features the largest Flash and RAM capacities

VULCAN X is meticulously crafted to excel in demanding operational environments, prioritizing efficiency and operator comfort.

With a focus on delivering superior performance and unparalleled reliability, Digi’s solutions enhance and transform the IoT landscape by enabling businesses to harness the power of connected technologies.

We announce the launch of the Express-VR7 module with up to 8 cores at 15W, 45W powered by AMD Ryzen Embedded V3000.

The unit is the first device in its class to be built around the latest Core processors.

The success of COM Express in the embedded market is a result of the broad respect given to the PICMG consortium.

These new industrial-grade Computer-on-Modules are ideal for high-performance AI edge applications with an ultra-low power (ULP) envelope featuring dual Arm Cortex-A72 processors, powerful AI accelerators, and 3D graphics.

This UWB tag solution seamlessly integrates the cutting edge Trimension™ SR040 chipset UWB silicon from NXP with the processing and Bluetooth LE capabilities of Nordic Semiconductor’s nRF52833 system-on-chip (SoC).

Android 12 features a reimagined UI, new privacy features designed for user safety, and more seamless ways to immediately get down to business, whatever the environment a user has to work in.

MERA-3100, a compact, fanless system that serve as a brain behind AGV operations.