Product news

In times of increasing miniaturization, maximum flexibility in electronics design is more in demand than ever.

The new MTE720T PCIe Gen 4x4 M.2 solid-state drive (SSD), boasting an increased sequential R/W up to 7,200MB/s and 6,500MB/s and a trusted endurance up to 3K P/E cycles.

ADLINK is a global provider of leading edge computing solutions and an NVIDIA® Quadro® Embedded Partner and Jetson™ Elite Partner.

COM-HPC Client Type Module & Server Type Module

The outstanding random speeds and endurance are ready to serve the 5G communication and AIoT markets as digital transformation continues apace.

ABP-3000 AI is powered by 8th Gen Intel® Core™ U-series processor delivering up to 40% greater productivity than the former generation.

Amtek’s RF connectors are typically used with coaxial cables and are designed to maintain the shielding that the coaxial design offers.

I-Pi SMARC Development Kit based on Qualcomm® Robotics RB5 Platform

The feature set in detail. The new conga-HPC/cALP COM-HPC Client Size A modules (95x120mm), as well as the conga-TC670 COM Express Compact Type 6 modules (95x95mm) are available with 6 energy efficient 12th Gen Intel Core processors as well as a cost optimized Celeron processor.

LittleBee Flash Based FPGAs, Arora SRAM Based FPGAs, GoBridge ASSP

Designed to power AI at the edge, ADLINK's deep learning acceleration platforms offer scalable, low-power AI interference, provide a variety of interfaces for image acquisition and allow for flexible I/O expansion to address application-specific requirements.