Product news

New Digi ConnectCore 93 Development Kit and system-on-module (SOM) variants.

While the modern world are pursuing new technologies every day, form factors like ETX, PC/104 and 3.5" SBC with legacy interfaces (For example, ISA) are rarely seen nowadays.

The portfolio now ranges from high-performance COM-HPC Server-on-Modules to ultra-compact and brand-new COM-HPC Client-on-Modules that are hardly larger than a credit card.

The embedded module TQMa62xx, is based on the processor family AM62xx (Quad /Dual / Single Cortex A53) from Texas Instruments. This module is designed to use the pin-compatible processors on one module design.

With the new Intel performance hybrid technology, the module offers excellent performance values in multi-thread / multi-tasking applications.

New COM-HPC Client Computer-on-Modules based on high-end processor variants of the 13th Gen Intel Core processors.

SMARC, as a next-gen Computer-On-Module, has been well known for its compact size and low power consumption.

Availability of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA assembly.

The SMARC 2.1 module TQMxE41S is available with a wide variety of processors in the power range 6 W to 15 W TDP.

The new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini standard is now entering the home stretch towards final ratification, which is scheduled for the first half of 2023.

congatec welcomes the ratification of the COM Express 3.1 standard with the launch of 10 compliant Computer-on-Modules based on 12th Gen Intel Core processors (formerly codenamed Alder Lake).

TQ is one of the Early Access Partners from NXP developing NXP-based Modules, Boards and Systems.

COM Express R3.1 Compliant Modules — ADLINK Express-ADP Type 6 Basic size and Express-ID7 Type 7 Basic size Now Available

Individual, manufacturer-specific or industry standard? When selecting the form factor for System on Modules, there are three options with their respective strengths and weaknesses.

COM.0 R3.1 Spec for COM Express to Include PCIe Gen 4 and USB 4.0 Support

EmSMK-i2403 is powered by Intel® Atom processor and supports onboard LPDDR4 SDRAM

The PICMG CPCI-S.0 CompactPCI Serial standard, which evolved from the PICMG 2.0 specification, is the fastest, most versatile, most cost-effective open standard for CompactPCI (CPCI).

ADLINK is a global provider of leading edge computing solutions and an NVIDIA® Quadro® Embedded Partner and Jetson™ Elite Partner.