Product news

New 3D triple level cell (TLC) S750/S650 Series SD and microSD memory cards built for the rigors of non stop video recording.

New product line with 3D TLC NAND offers prime quality, reliability and endurance at lower cost per GB

The NVMe transport protocol delivers high bandwidth and low latency through the PCI Express (PCIe) bus. ATP M.2 2280 and U.2 SSDs based on NVMe specifications deliver fast response times even for complex applications.

You are probably informed about the news from WD/KIOXIA regarding wafer contamination significantly impacting their 3D TLC NAND output.

ATP’s managed NAND solutions integrate raw NAND flash memory and hardware controller. As soldered-down solutions, they are secure against constant vibrations, making them ideal for embedded and automotive applications requiring rugged endurance and durability.

The A750Pi and A650Si/Sc Series embedded SSDs are built on 3D triple level cell (TLC) NAND flash.

We continue our blog series on ATP's reliability testing with EOL Validation Test

M.2, U.2, HSBGA and EDSFF. What do these flash storage devices have in common?

Multi-layered privileges, sanitization features offer high levels of storage security to safeguard data from authorized acces

The N700 Series PCIe® Gen3 x4 NVMe M.2 Type 1620 heatsink ball-grid array (HSBGA) SSD are built with 3D TLC NAND flash configured as pSLC to deliver near native SLC performance at lower cost due to the higher cell density.

ATP announced the latest NVMe SSDs with thermal options, including specialized copper foil and fin-type heatsinks for NVMe M.2 2280 modules, and thermal pad for U.2 SSDs.

The ATP A700/E700 Series is a new generation of Premium Line flash storage built with 3D triple-level cell (TLC) NAND configured as pseudo single-level cell (pSLC). This generation offers unprecedented benefits.

The ATP e.MMC integrates raw NAND flash memory and hardware controller integrated within a 153-ball fine pitch ball grid array (FBGA package).

The A700Pi/E700Pi Series, a new generation of Premium Line pSLC NAND-based embedded SSDs.

M.2 Solid State Modules for Embedded Systems are now available in Industrial Temperature Range from -40°C to +85°C, up to 2TB of memory and deliver boosted performance into sequential read up to 3.280 MB/s.

The ATP e.MMC integrates raw NAND flash memory and hardware controller integrated within a 153-ball fine pitch ball grid array (FBGA package).

Data security is of utmost importance in portable removable storage devices.

From 120GB to 1,920GB models, up to 3,420/3,050MB/s sequential RW speeds, up to 5,120TB endurance, and available in I-Temp (N600Si) and C-Temp (N600Sc) ratings