Compact Board-to-Board solutions in 1.27mm pitch

PCIe Gen 3 x 4 NVMe storage solutions

07/05/2021

The N700 Series PCIe® Gen3 x4 NVMe M.2 Type 1620 heatsink ball-grid array (HSBGA) SSD are built with 3D TLC NAND flash configured as pSLC to deliver near native SLC performance at lower cost due to the higher cell density.

For effective thermal dissipation, these small powerhouses are outfitted with heatsink on top for 2X-3X better sustainable performance.

ATP can accommodate the HSBGA onto an M.2 2230 module with the same firmware and NAND configuration for customers who prefer a removable and field-replaceable design.

Main Features

PCIe Gen3 x4, NVMe 1.3, M.2 Type 1620
pSLC mode with 2X-3X of Sustainable Performance* Under highest Sequential write value. May vary by density, configuration and applications.
High/Stable performance with Optimized Thermal Throttling Firmware/Heatsink (HSBGA)
Optimized Power Consumption: 5 mW during Power State 4
DRAM-less configuration supporting HMB (Host Memory Buffer)* Under highest Sequential write value. May vary by density, configuration and applications.
Optional Security features available** Optional, by project support.

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