Product news

The i.Core RK3568, Engicam’s latest SOM based on the Rockchip RK3568 processor.

The SBC35-ASL is a versatile and high-performance 3.5" single board computer, designed to meet the demands of industrial and outdoor applications.

Congatec, a global leader in embedded and edge computing, has invested in the majority of Kontron’s Computer-on-Module business – including JUMPtec , the original pioneer of standardized COMs.

Digi XBee® 3 BLU supports Bluetooth Low Energy 5.4 for short-range communication in applications such as renewable energy, smart lighting, and industrial IoT.

The ultra-compact fanless system, the EPC-ASL, is built on the Intel® Alder Lake-N platform.

The conga-STDA4 is a SMARC module based on the TI TDA4VM application processor or DRA829J Arm processor, and is designed to operate in the harshest of environments.

congatec's COM Express Type 6 ecosystem, featuring the new conga-TC750 modules, delivers high performance for demanding applications.

The conga-aCOM/mRLP is an application-Ready COM-HPC Mini Size module based on 13th Gen Intel® Core™ processor.

Next-generation COM-HPC module, ESM-HRPL, along with the high-performance carrier board EEV-HC10. Designed for compute-intensive edge applications.

With the new TQMa67xx module, TQ expands the performance spectrum of its ARM-based TI solutions.

aReady.IOT empowers you to remotely monitor, control, and efficiently manage your Computer-on-Module-based applications, connected peripherals, and diverse sensors.

The COM-HPC-mMTL is an innovative module that stands as the only small form factor solution available with Intel Core Ultra architecture and rich I/O capabilities.

TQMx41E :Intel Atom® Processors x7000E Series, Intel Atom® Processors x7000RE Series, Intel® Core™ i3-N305 Processor, and Intel® Processor N Series

OSM-IMX8MM: Open Standard Module-Computer on Module with NXP i.MX8M Mini Arm Cortex-A53

A SMARC® SOM with powerful processing using NXP i.MX 93 and Wi-Fi 6E Connectivity

The OSM-MTK510 is an Open Standard Module R1.1 Size-L module featuring the advanced MediaTek Genio 510 series processor.

The solderable DHCOS STM32MP2x System on Module based on the powerful STM32MP25x processor from STMicroelectronics combines flexibility and pin-compatibility.

The TQMa8MPxS based on the i.MX 8M Plus supports with many features and an integrated NPU (Neural Processor Unit) w