Main Features
- Up to 14 CPU cores, 8 Xe GPU and NPU integrated
- Up to 64GB LPDDR5x memory
- Up to 16 PCIe lanes, 2x 2.5GbE Ethernet
- Multiple DDI/USB4, USB3/2.0 and SATA
- Rugged operating temperature: -40°C to +85°C (optional, selected SKU)
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The COM-HPC-mMTL is an innovative module that stands as the only small form factor solution available with Intel Core Ultra architecture and rich I/O capabilities. This makes it the perfect fit for edge applications that demand both superior processing power and versatile connectivity.
Powered by the Intel® Core™ Ultra architecture with up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, combining ultra-power with energy efficiency. It is excellent for high-performance, battery-powered applications, such as industrial automation, data loggers, UAVs (Unmanned Aerial Vehicles), portable medical ultrasound devices, and AI-powered robots.
Powered by the Intel® Core™ Ultra architecture with up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, combining ultra-power with energy efficiency.
Adlink's mission is to affect positive change in society and industry by connecting people, places and assets with artificial intelligence; we do this through the delivery of leading edge, robust and reliable hardware and software solutions that directly address mission-critical business and technology challenges.