xG27 Wireless SoC Brings Small Size, High Performance to Industrial…

xG27 Wireless SoC Brings Small Size, High Performance to Industrial Applications

21/07/2023

Announced in March, Silicon Labs’ EFR32xG27 (xG27) family of wireless SoCs is now available to purchase, and its feature set is ideally suited to bring new functionality and design possibilities to industrial applications. These devices have been designed for ultra-low-power, small footprint applications including asset tracking of tools and warehouse equipment.

This new addition to our portfolio comes in response to several trends driving industrial and commercial development, including the utility and convenience of remote monitoring, advances in battery capacity, and the increasing miniaturization of devices.

Main Features

An ultra-low-power SoC: that enables Bluetooth Low Energy and Bluetooth mesh for IoT devices such as tools, sensors, remote key entry, and tire monitoring.
High-performance wireless on a tiny footprint: featuring the best-in-class Bluetooth Low Energy performance in a small SoC package
WLCSP package with dimensions of 2.3 x 2.6 mm (19 GPIO): allows IoT device makers to enable Bluetooth Low Energy on extremely small form-factor robots and wearables.
The integrated DCDC Boost on xG27: provides IoT device makers a wide voltage range, 0.8 V - 1.7 V or 1.8 V - 3.8 V running down to 0.8 volts, enabling the use of single-cell alkaline and button cells to reduce the device form factor and cost.
The wakeup pin: (BOOST_EN) on the BG27 allows products in a warehouse or transit to remain off for months, consuming less than 20 nA until awoken, ensuring the battery of the device remains fully charged for use.
The integrated Coulomb Counter: enables accurate battery level monitoring for notifications to the user that a water, proximity, weight, pressure, or safety sensor needs to be replaced.

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