Product news

While many of MPS’ power solutions provide a compact footprint, not all of MPS’ parts are smaller than Enpirion’s but in scenarios of size discrepancy, MPS components tend to have higher efficiency.

Recently, the serial production of two long-awaited diagonals in the e‑paper sector, which are closing the gap between 13.3" and 31.2", has started.

MultiTech announced the availability of new accessories for use with the MultiTech Conduit® Programmable Gateway and MultiTech Conduit® IP67 Base Station.

The EM510 is an ultra-compact Tibbo BASIC/C-programmable IoT Module with a single UART, Ethernet, and optional Wi-Fi/BLE* (Bluetooth Low Energy) connectivity.

New industry first and smallest 9-in-1 combination antenna with dual-band GNSS and high-performance 5G/4G

The Z-Wave 800 series is the latest edition of the world’s most popular Z-Wave wireless IoT mesh protocols for smart homes.

Available immediately, the MPO-550MS, an ultra-miniature, high performance 550W switching power supply.

New generation Arm® Cortex®-M0+ Brushless DC motor microcontroller device, the HT32F65232.

Amtek offers Flexible Flat cables. They have consistent electrical characteristics.

The Nautiz X41 is a compact and light-weight rugged handheld designed for efficient field data collection and communication.

AC/DC and DC/DC COTS Brick Power Supply Modules, AC/DC & DC/DC UPS and Bulk Power Supplies, EMI, EMC and RF Filter Solutions

After nearly 45 years, ELECTRONIC ASSEMBLY, the specialist for high-quality industrial displays, changes its name and will from now on be called DISPLAY VISIONS.

Powered by the NVIDIA® Jetson AGX Xavier™ system-on-module, Vecow EAC-3000 is compact, rugged and power-efficient for industrial-grade applications that need trusted reliability and performance in harsh environments.

Mainstream models HPS-621UTA (Tower workstation) and HPS-621U4A (4U rackmount) support first- and second-generation Intel® Xeon® scalable processors, Intel® C621 chipset, built-in 6-channel DDR4 slot, multicard configuration with three PCIe x 16 or six PCIe x 8 slots, three front 2.5-inch HDD removable modules for easy capacity expansion, and diverse high-speed I/O interfaces (1xRS232, 1xVGA, 6xUSB3.2 and 4xRJ-45 network port).

AirLink® Routers & Gateways connect your remote organizational assets – people, locations and infrastructure – securely to the enterprise network, and allow you to remotely configure, deploy, monitor and manage these assets with cloud-based or on-premises management systems.

FG160 is a 3GPP R16-compliant 5G module adopting LGA + LCC form factor. Designed with the Qualcomm QCM6490 chipset, SC171 integrates an Octa-core processor and vDSP, supporting multiple networks, GNSS positioning as well as rich interfaces.

GOWIN Semiconductor is a best-in-class price/performance FPGA manufacturer.