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174 results
  • Schermafbeelding 2022 07 01 104051
    01.07.2022

    Congatec extends its 12th Gen Intel Core processor based COM-HPC and COM Express Computer-on-Module portfolio

    The feature set in detail. The new conga-HPC/cALP COM-HPC Client Size A modules (95x120mm), as well as the conga-TC670 COM Express Compact Type 6 modules (95x95mm) are available with 6 energy efficient 12th Gen Intel Core processors as well as a cost optimized Celeron processor.

  • Digi connectcore mp1 front angle
    24.06.2022

    Intelligent, wireless and secure embedded system-on-module

    Digi ConnectCore MP1 modules deliver a highly integrated and secure connected system-on-module solution.

  • Schermafbeelding 2022 06 17 092839
    17.06.2022

    DHCOM i.MX8M Plus Powerful SoM module with NPU

    Powerful dual or quad Cortex-A53 processor with Neural Processing Unit.

  • Schermafbeelding 2022 05 19 144638
    20.05.2022

    COM Express Type 6 Module with New AMD Ryzen™ Embedded V2000 APU

    The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz.

  • Schermafbeelding 2022 05 20 091633
    20.05.2022

    Intel® Atom™ E3800 family COM Express® Mini Type 10 CPU Module

    EmNANO-i230V is powered by Intel’s Atom E3825/E3845 Processor, the compact size COM Express Mini Type 10 form factor offers flexibility and scalability that are critical to system integrations.

  • EMB TQ Ma8 M Px L new
    20.05.2022

    Embedded Cortex®-A53 Modul based on i.MX 8M Plus with machine learning hardware support

    The TQMa8MP based on the i.MX 8M Plus supports with many features and an integrated NPU (Neural Processor Unit) with up to 2.3 TOPS and an IPU (Image Processor Unit)

  • Schermafbeelding 2022 05 05 200820
    06.05.2022

    Deep Learning Accelerator from ADLINK

    ADLINK’s deep learning accelerators provide GPU-accelerated inferencing in embedded and standard form factors and offer high performance, power efficiency and longevity support required of edge AI applications

  • Engicam X Touch20
    15.04.2022

    General purpose carrier board

    General-purpose Carrier Board compliant with Engicam standard SmarCore SOMs and Open Frames.

  • Schermafbeelding 2022 04 07 162614
    08.04.2022

    Embedded boards in different form factors for different industrial chassis

    Alcom brings Arbor's embedded computing products to the Benelux market.

  • Schermafbeelding 2022 03 11 094443
    11.03.2022

    Vecow Launches Computer-on-Module Based on COM Express Compact Form Factor

    The Vecow COM Express® product portfolio VCOM-1600 and VCOM-BASE are based on Intel Atom® x6000E processor, is designed in a compact size and provides power-efficient, with enhanced graphics performance and flexibility capabilities to power the Edge applications.

  • Congatec simplyfies com HPC design
    18.02.2022

    congatec simplifies COM-HPC designs

    Congatec welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs.

  • Adlink COM HPC c ADP F
    04.02.2022

    COM-HPC Client Type modules with 12th Gen Intel® Core™ processors

    The world’s first 12th Gen Intel Core processor-based Computer-on-Modules (COMs), available in two form factors: COM-HPC Client Type and COM Express Type 6.

  • Arbor Em NANO i2402 F
    28.01.2022

    New COM Express (Type 10) module

    Soldered onboard Intel Apollo Lake SoC Processor, Intel I210IT PCIe GbE conntroller, Support Intel® Solid State Drive (SSD) Embedded "E SKU's, Single Channel 24-bit LVDS and 1 x DDI port

  • Congatec Alder Lake coms
    21.01.2022

    10 new COM-HPC and COM Express Computer-on-Modules

    2th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules

  • LEC RB5 F
    14.01.2022

    Integrated IoT technologies provide on-device AI capabilities at the edge

    SMARC Short Size Module with Qualcomm® QRB5165 Series octa-core SoC

  • Schermafbeelding 2021 12 02 150822
    03.12.2021

    CoMe type6 Computer-on-Module

    ARBOR's embedded boards and solutions support wide temperature environment, suitable for industrial applications in harsh environments.

  • TQ TQ Ma117x L
    12.11.2021

    New embedded module based on NXP

    The TQMa117xL, based on the i.MX RT1170 CPU from NXP, scores with a compact size of only 31 mm x 31 mm and provides all CPU signals via a total of 277 LGA pads.

  • Avalue RSC i MX8 M small
    05.11.2021

    RSC-IMX8M, a 3.5-inch NXP® i.MX8M Single Board Computer

    RSC-IMX8M is a 3.5-inch single-board computer that supports NXP® i.MX8M Quad ARM Cortex A53 Quad Core Up to 1.5GHz; Cortex-M4 core processor, providing an ultra-low power consumption with the TDP is less than 3.5W.

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