Product news

The TGS-1000 Series is a ultra-compact stackable AI PC powered by the all-new hybrid architecture Intel® Core™ Ultra Processor.

High-Performance Computing Platform Boosts Deep Learning, Cloud AI Inference for Sustainable Future

TLVR Choke LVR1005 series, an innovative inductor designed for AI server core power supplies.

The AIB-NVAO, an embedded AI industrial computer specifically designed for autonomous machine intelligence.

First Arm® Cortex®-M7 core microcontroller (MCU) product family, the GD32H737/757/759 ultra-high performance MCU series.

SiTime’s latest innovation, the MEMS-based Chorus™ clock-system-on-a-chip (ClkSoC), is the first integrated clock generator for AI datacenter applications.

Introducing our latest advancements: the SmarCore STM32MP25x and i.Core STM32MP25x. modules, powered by the cutting-edge STM32 MPUs from ST® Microprocessors.

The MTE560P, features both SLC Mode and Power Loss Protection (PLP). N

ABP-4000 is the latest addition Vecows ultra-compact embedded systems.

Adlink extended its portfolio of GPU modules with the introduction of the A380E graphics card – the company’s first graphics card in low profile PCIe form factor employing an Intel Arc A380E GPU.

The Vecow SPC-9000 is an Ultra-compact Fanless Embedded System powered by the latest Intel® Core Ultra Processor (14th Gen), providing an optimal balance of performance and power efficiency.

The S650Si (TLC) and S750Pi (pSLC) Series SD and microSD memory cards built with 176-layer 3D NAND technology and low-density parity check (LDPC) controller.

In a versatile standard for small-size and low-cost soldered-down including the OSM-IMX93 (NXP i.MX 93), OSM-IMX8MP (NXP i.MX 8M Plus) a complete and competitive product portfolio based on leading edge CPU cores suited for a variety of applications will be announced and available shortly(Q2’24).

Congatec expanded its ecosystem for modular edge servers. New products include a server carrier board in µATX form factor and COM-HPC Server-on-Modules based on the latest Intel Xeon D processors (Ice Lake).

This enhancement includes AI Computing Systems, High-performance Fanless Systems, and Expandable Fanless Systems, all featuring the latest Intel® Core™ i9/i7/i5/i3 Processors (14th Gen).

Unleash Edge AI Power with ARBOR's FPC-9108-P6-G3 Ruggedized AIoT Computer

Gowin devices offer replacement options for these Xilinx product families that are made End of Life.

ARES-1980-AI and ELIT-1060-AI are industrial controllers for embedded AI applications. Introducing Hailo-8, an AI accelerator designed for high-performance edge computing and AI graphic applications.