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Congatec introduces new ecosystem for COM-HPC

04/12/2020

Congatec introduces the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG® COM-HPC™ standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilization of congatec’s COM-HPC modules based on the latest 11th Gen Intel® Core™ processors (code name Tiger Lake). The new COM-HPC standard impresses with a broad range of latest high-speed interfaces such as PCIe Gen 4 and USB4, a future proof high-speed connector, and a comprehensive feature set for remote management. The latter, in particular, is of utmost importance for all the emerging broadband connected edge applications, which range from dedicated edge devices to rugged edge clouds and real-time fogs.

Documents Tech question
Congatec csm COPR2023 COM HPC Carrierboard and Cooling

Congatec introduces new ecosystem for COM-HPC

  • Features
  • Technologies
  • Manufacturer
  • Documents

Features:

  • COM HPC Client Size A
  • PCI Express Gen 4 ​
  • Embedded/Industrial use condition
  • Extended temperature options available
  • Integrated high performance Xe (Gen 12) graphics with 96 EU
  • AI/DL Instruction Sets including VNNI

Technologies

  • Shutterstock 1178903887

    Computer & System-on-Modules

Congatec

Congatec is a rapidly growing technology company focussing on high-performance embedded computing products, so-called computer-on-modules and industrial single board computer.

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Documents

  • Congatec milestone for COM HPC integration info sheet
  • Conga HPC c TLU Datasheet
  • Congatec com hpc Datasheet
Pexels thisisengineering 3913017

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