Electronic Component Solutions

Pre-Certified Wireless Modules for a Broad Range of IoT Applications

The portfolio consists of the only modules in the industry with full stack support for multiprotocol solutions to enable commercial and consumer IoT applications, with flexible package options and highly integrated device security.
The new modules offer a simple, effective solution to the complex problem of RF engineering and testing, allowing IoT device makers to quickly get pre-certified and secure wireless devices into the market.

 

Silicon Labs highly integrated modules are available in multiple package options including system-in-package (SiP) and traditional printed circuit board (PCB). SiP modules contain miniaturized components that remove the need for complicated RF design and certification by opening space-constrained IoT designs to module-based solutions. PCB modules enable flexible pin access and additional options to extend RF performance.

  • xGM210PB features Secure Vault, ARM PSA Level 2
  • BGM220 is one of the world’s smallest Bluetooth modules
  • MGM220 is a low-power, low-cost ideal for eco-friendly, ultra-low-power IoT products
  • BGX220 Xpress includes an onboard Bluetooth stack, Xpress command interface and pre-programmed cable replacement firmware

Choice of Bluetooth, Zigbee, Thread and Multiprotocol modules speed time-to-market by addressing developer pain points with industry-leading security for smart home, building and industrial automation applications

BGM220P BGX220P MGM220P xGM210P