Wireless & Networking

Industrial Dual Band, 2×2 MIMO Wi-Fi, BT & BLE Module

WG7837V0 series SiP (System in Package) module, is the most demanded design for all handset and portable devices with TI WiLink8 IEEE 802.11 a/b/g/n and Bluetooth, Bluetooth LE solutions to provide the best Wi-Fi and BT coexistence interoperability and power saving technologies from TI.

  • Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives and Power Management
  • LGA‐100 pin package
  • 13.3 x 13.4 x 2.0 mm
  • FCC, IC, ETSI/CE, and TELEC Certified With Chip Antennas
  • Operating temp: ‐40°C to 85°C

WG7837V0