- Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives and Power Management
- LGA‐100 pin package
- 13.3 x 13.4 x 2.0 mm
- FCC, IC, ETSI/CE, and TELEC Certified With Chip Antennas
- Operating temp: ‐40°C to 85°C
WG7837V0 series SiP (System in Package) module, is the most demanded design for all handset and portable devices with TI WiLink8 IEEE 802.11 a/b/g/n and Bluetooth, Bluetooth LE solutions to provide the best Wi-Fi and BT coexistence interoperability and power saving technologies from TI.