Embedded Computing

Congatec introduces new ecosystem for COM-HPC

Congatec introduces the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG® COM-HPC™ standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the utilization of congatec’s COM-HPC modules based on the latest 11th Gen Intel® Core™ processors (code name Tiger Lake). The new COM-HPC standard impresses with a broad range of latest high-speed interfaces such as PCIe Gen 4 and USB4, a future proof high-speed connector, and a comprehensive feature set for remote management. The latter, in particular, is of utmost importance for all the emerging broadband connected edge applications, which range from dedicated edge devices to rugged edge clouds and real-time fogs.

  • COM HPC Client Size A
  • PCI Express Gen 4 ​
  • Embedded/Industrial use condition
  • Extended temperature options available
  • Integrated high performance Xe (Gen 12) graphics with 96 EU
  • AI/DL Instruction Sets including VNNI

Press Release COM-HPC conga-HPC_cTLU