Embedded Computing

COM Express Computer-on-Module with 3 GHz Intel® Core™ i3 processor

New Computer-on-Module for the entry-level of high-end embedded computing based on Intel’s® latest Core™ i3-8100H processor platform. The new high-performance platform convinces with its optimized cost and performance-per-watt quad-core processor as well as support for low-power high-bandwidth DDR4 RAM.

Its fast 16 PCIe Gen 3.0 lanes make it a perfect candidate for all the new artificial intelligence (AI) and machine learning applications requiring multiple GPUs for massive parallel processing. The integrated Intel® HD graphics UHD 630 is optimized in terms of clock rate and driver, which provides additional TDP headroom for even more GPGPU performance or 4k UHD graphics.

All this makes the new COM Express Basic Computer-on-Module the performance-per-watt champion for price sensitive high-performance applications, that comes on demand with sophisticated passive or active cooling solutions from a single source.

Features:

  • 8th Generation Intel® Core™ processor with up to 6 Cores
  • Intel® Xeon® processors for data center applications
  • Support for USB 3.1 Gen2 with 10Gb/s
  • Intel® Optane™ memory support
  • ECC memory support
  • Up to 32 GByte dual channel DDR4 memory
Processor Cores / Threads Clock [GHz] (Base/cTDP down) Cache (MB) GPU Compute Units TDP/ cTDP [W]
Intel® Core™ i3-8100H 4 / 4 3.0 / 2.6 6 24 45 / 35

Conga -TS370 Datasheet