Product news

aReady.IOT empowers you to remotely monitor, control, and efficiently manage your Computer-on-Module-based applications, connected peripherals, and diverse sensors.

The new COM-HPC Client Size C (120x160 mm) modules are based on the performance hybrid architecture of the Intel Core S processors (codenamed Bartlett Lake S) with up to 16 Efficient (E) and up to 8 Performance (P) cores for up to 32 threads.

Specially designed for industrial requirements, they deliver eight processor cores –which is double the previous generation – while maintaining the same power consumption.

SMARC Module based on TI Processors TDA4VM and DRA829J

New COM Express Compact modules with AMD Ryzen Embedded 8000 Series for high-performance AI applications at the edge

New high-performance computer-on-modules (COMs) with i.MX 95 processors from NXP, thereby expanding its extensive module portfolio with low-power NXP i.MX Arm processors.

NXP i.MX 8M Plus 14nm processor series with ARM 4-Core Cortex-A53 / M7 + NPU.

Congatec expanded its ecosystem for modular edge servers. New products include a server carrier board in µATX form factor and COM-HPC Server-on-Modules based on the latest Intel Xeon D processors (Ice Lake).

Explore high-performance embedded building blocks that drive efficiency, performance, and adaptability from COM to cloud, revolutionizing embedded computing designs.

The Hypervisor is available as an easy addition to congatec’s x86-based Computers-on-Modules (COMs). Now the Hypervisor will be implemented in firmware and will be standard on all congatec x86 COMs

New high-end COM-HPC Computer-on-Modules based on the 14th Generation Intel Core processors (codename Raptor Lake-S Refresh).

Providing a unique combination of heterogeneous compute engines, including CPU, GPU and NPU, the new modules are an ideal fit to run demanding AI workloads at the edge.

Our COM-HPC ecosystems are specifically engineered to provide everything developers need to be first to market with industry-leading solutions

These new industrial-grade Computer-on-Modules are ideal for high-performance AI edge applications with an ultra-low power (ULP) envelope featuring dual Arm Cortex-A72 processors, powerful AI accelerators, and 3D graphics.

The conga-TC570r COM Express Type 6 Compact modules, based on the 11th Generation Intel® Core™ processor family (code name "Tiger Lake"), have received IEC-60068 certification.

Get into the fast lane to IoT-connected industrial application development with our conga-SA7 Computer-on-Modules.

The latest SMARC modules leverage the TI Jacinto 7™ processor, bringing accelerated vision and AI processing alongside real-time control to your industrial and mobile machinery solutions.

In attachment you can download an article written by Christian Eder, Director of Marketing at Leading CoM module manufacturer Congatec, represented since its foundation by Alcom electronics.