Product news

The conga-STDA4 is a SMARC module based on the TI TDA4VM application processor or DRA829J Arm processor, and is designed to operate in the harshest of environments.

congatec's COM Express Type 6 ecosystem, featuring the new conga-TC750 modules, delivers high performance for demanding applications.

The conga-aCOM/mRLP is an application-Ready COM-HPC Mini Size module based on 13th Gen Intel® Core™ processor.

aReady.IOT empowers you to remotely monitor, control, and efficiently manage your Computer-on-Module-based applications, connected peripherals, and diverse sensors.

The new COM-HPC Client Size C (120x160 mm) modules are based on the performance hybrid architecture of the Intel Core S processors (codenamed Bartlett Lake S) with up to 16 Efficient (E) and up to 8 Performance (P) cores for up to 32 threads.

Specially designed for industrial requirements, they deliver eight processor cores –which is double the previous generation – while maintaining the same power consumption.

SMARC Module based on TI Processors TDA4VM and DRA829J

New COM Express Compact modules with AMD Ryzen Embedded 8000 Series for high-performance AI applications at the edge

New high-performance computer-on-modules (COMs) with i.MX 95 processors from NXP, thereby expanding its extensive module portfolio with low-power NXP i.MX Arm processors.

NXP i.MX 8M Plus 14nm processor series with ARM 4-Core Cortex-A53 / M7 + NPU.

Congatec expanded its ecosystem for modular edge servers. New products include a server carrier board in µATX form factor and COM-HPC Server-on-Modules based on the latest Intel Xeon D processors (Ice Lake).

Explore high-performance embedded building blocks that drive efficiency, performance, and adaptability from COM to cloud, revolutionizing embedded computing designs.

The Hypervisor is available as an easy addition to congatec’s x86-based Computers-on-Modules (COMs). Now the Hypervisor will be implemented in firmware and will be standard on all congatec x86 COMs

New high-end COM-HPC Computer-on-Modules based on the 14th Generation Intel Core processors (codename Raptor Lake-S Refresh).

Providing a unique combination of heterogeneous compute engines, including CPU, GPU and NPU, the new modules are an ideal fit to run demanding AI workloads at the edge.

Our COM-HPC ecosystems are specifically engineered to provide everything developers need to be first to market with industry-leading solutions

These new industrial-grade Computer-on-Modules are ideal for high-performance AI edge applications with an ultra-low power (ULP) envelope featuring dual Arm Cortex-A72 processors, powerful AI accelerators, and 3D graphics.

The conga-TC570r COM Express Type 6 Compact modules, based on the 11th Generation Intel® Core™ processor family (code name "Tiger Lake"), have received IEC-60068 certification.