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The series 9231 Type D connects all advantages of both Surface Mount (SMT) and Through Hole Reflow (THR) technologies.
This combination is beneficial, when it comes to stability in small spaces. Thanks to the through-hole-assembled contacts, the THR method ensures a reliable and vibration resistant connection. Surface-mounted SMT pins require little space, without additional drilling on the PCB. This saved area is available for conducting paths. THR-SMT mixed combinations are applied wherever the circuit board architecture needs reliable and at the same time space saving components. W+P provides mating parts and further mixed-technology-connectors.
Insulator | Thermoplastic, rated UL94 V-0 |
Contact Material | 0.635mm square pin, copper alloy |
Contact Surface | Acc. to options (see below), over Ni (1.3 … 2.5µm) |
Contact Resistance | < 20 mΩ |
Insulation Resistance | > 1000 MΩ |
Test Voltage | 500 V AC |
Voltage Rating | 250 V AC |
Current Rating | 3 A |
Temperature Range | -40 °C … +125 °C |
Processing | Reflow soldering |