Main Features
xG27 SoC Connects One of World's Smallest Wearable Devices
- Wafer-level Chip Scale Packaging as small as 2.3 mm x 2.6 mm, ideal for compact and unobtrusive devices like medical patches, continuous glucose monitors, wearable electrocardiograms, and asset tags in various settings like retail and agriculture.
- Integrated DCDC Boost that can allow the devices to operate on batteries as low as 0.8 V, thereby reducing their devices' size, form factor, and cost.
- Integrated Coulomb Counter that enables battery level monitoring to avoid battery depletion during the use of applications, improving user experience and product safety.
- Advanced security with Silicon Labs Secure Vault with Virtual Security Engine (VSE) for secure boot and debug hardened against glitch attacks, tamper protection, and additional features designed to protect the device and its users' data from local and remote cyber threats.
- Shelf Mode that reduces energy use to less than 20 nano amperes so that devices can be transported and stocked on shelves while maintaining nearly full battery life for the end-user.
New BB50 8-bit MCUs Increase Design Flexibility While Reducing Cost and Complexity
- Common tools and software for 8-bit and 32-bit, like Silicon Labs Simplicity Studio and a fully-featured 8-bit compiler.
- A high-performance core optimized for a large number of single-cycle instructions to improve operating efficiency.
- Wide operating voltages and low-power modes for battery applications to improve energy efficiency for a large variety of battery sizes.
- Various packaging options ranging from 2 mm-squared to 5 mm-squared to optimize for size needs.
- Hundreds of firmware examples allow customers to easily add functionality to an existing product with little or no additional firmware development effort.
