Our innovative 5-Cent Cooling Solution is also compatible with the DHCOM i.MX8M Plus SOM. The powerful System on Module with NPU can perform numerous complex computing operations in the shortest possible time. The heat generated in the process, especially when compute modules are installed in devices with housings, must be dissipated. The DHCOM i.MX8M Plus is designed for a industrial storage and operating temperature of -25 to +85 °C.
With our 5-Cent Cooling Solution, heat is dissipated from the processor through thermal vias into the inner copper layers of the PCB via a 5-Cent copper surface using a gap pad. There, the heat is distributed evenly over the carrier board and is dissipated to the environment primarily by convection and heat radiation. The even heat distribution protects the remaining components from overheating. If required, additional heat dissipation can be connected to the 5-Cent copper surface on the underside of the carrier board. For example, the housing can be used for optimum heat dissipation via an additional gap pad.