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BiCS5 112-layer 3D NAND Industrial-grade SSDs

21/01/2022

Designed with the high-speed PCIe and SATA III interface, Transcend's 112-layer 3D NAND SSDs include SSDs with DRAM and DRAM-less SSDs. SSDs with DRAM deliver high TBW, while substantially increasing the sequential R/W speeds; DRAM-less SSDs ensure higher data integrity, and they bring businesses higher cost efficiency. The series is embedded with ECC engine functionality, RAID engine data protection, global wear leveling, bad block management, garbage collection, and dynamic thermal throttling. Industrial-level reliability is thus guaranteed to meet the needs of embedded applications.

Main Features

  • BiCS5 SSDs have 50% higher write speed compared to BiCS4 96-layer SSDs
  • Reliable operation under extended temperature (-20˚C ~ 75˚C); Wide temperature (-40˚C ~ 85˚C) is available for specific models
  • Built-in Corner Bond technology for SSDs without enclosure to protect key components
  • 30µ" PCB gold finger for enhanced durability
  • Anti-sulfur technology implemented to prevent sulfurization in the environment
  • Fixed BOM and product lifecycle management (PLM) to maintain stable product supply
Documents Tech question
Transcend Bi CS5

BiCS5 112-layer 3D NAND Industrial-grade SSDs

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Transcend

Transcend memory for embedded solutions include SSD and Flash solutions, Memory Cards and DRAM Modules.

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  • Transcend SSD460 K Datasheet
  • Transcend MTE670 T Datasheet
  • Transcend MTE710 T Datasheet
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