- 40% Less Space of Footprint
- Complies with JEDEC e.MMC v5.1 Standard (JESD84-B51)
- 153-ball FBGA (RoHS compliant, "green package")
- LDPC ECC engine
- Designed with 3D TLC NAND
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ATP 9x10 e.MMC Embedded Flash Storage Solution Smaller than a typical e.MMC, ATP 9x10 e.MMC comes in a 153-ball fine pitch ball grid array (FBGA package).The tiny footprint/package size makes it perfectly suitable for embedded systems with space constraints. Its low power consumption will be a major factor in wearable device configuration.
ATP Electronics is the leading provider of “Industrial Only" high-performance, high-quality and high-endurance NAND flash products and DRAM modules.